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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad 2-Input Multiplexer/ Latch
The MC10H173 is a quad 2-input multiplexer with latch. This device is a functional/pinout duplication of the standard MECL 10K part, with 100% improvement in propagation delay and no increase in power supply current. * Data Propagation Delay, 1.5 ns Typical * Voltage Compensated * Power Dissipation, 275 mW Typical * MECL 10K-Compatible * Improved Noise Margin 150 mV (over operating voltage and temperature range) MAXIMUM RATINGS
Characteristic Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current -- Continuous -- Surge Operating Temperature Range Storage Temperature Range -- Plastic -- Ceramic Symbol VEE VI Iout TA Tstg Rating -8.0 to 0 0 to VEE 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc mA C C C
MC10H173
L SUFFIX CERAMIC PACKAGE CASE 620-10 P SUFFIX PLASTIC PACKAGE CASE 648-08 FN SUFFIX PLCC CASE 775-02
TRUTH TABLE
SELECT CLOCK L L H Q0n + 1 D00 D01 Q0n
ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (See Note)
0 Characteristic Power Supply Current Input Current High Pins 3-7 & 10-13 Pin 9 Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Symbol IE IinH -- -- IinL VOH VOL VIH VIL 0.5 -1.02 -1.95 -1.17 -1.95 510 475 -- -0.84 -1.63 -0.84 -1.48 -- -- 0.5 -0.98 -1.95 -1.13 -1.95 320 300 -- -0.81 -1.63 -0.81 -1.48 -- -- 0.3 -0.92 -1.95 -1.07 -1.95 320 300 -- -0.735 -1.60 -0.735 -1.45 A Vdc Vdc Vdc Vdc Min -- Max 73 Min -- 25 Max 66 Min -- 75 Max 73 Unit mA A
H L X
DIP PIN ASSIGNMENT
Q0 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC Q2 Q3 D20 D21 D30 D31 SELECT
AC PARAMETERS
Propagation Delay Data Clock Select Set-up Time Data Select Hold Time Data Select Rise Time Fall Time tpd 0.7 1.0 1.0 tset 0.7 1.0 thold 0.7 1.0 tr tf 0.7 0.7 -- -- 2.4 2.4 0.7 1.0 0.7 0.7 -- -- 2.4 2.4 0.7 1.0 0.7 0.7 -- -- 2.4 2.4 ns ns -- -- 0.7 1.0 -- -- 0.7 1.0 -- -- ns 2.3 3.7 3.6 0.7 1.0 1.0 2.3 3.7 3.6 0.7 1.0 1.0 2.3 3.7 3.6 ns ns
Q1 D11 D10 D01 D00 CLOCK VEE
NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50-ohm resistor to -2.0 volts.
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6-11 of the Motorola MECL Data Book (DL122/D).
3/93
(c) Motorola, Inc. 1996
2-53
REV 5
MC10H173
APPLICATION INFORMATION
The MC10173 is a quad two-channel multiplexer with latch. It incorporates common clock and common data select inputs. The select input determines which data input is enabled. A high (H) level enables data inputs D00, D10, D20, and D30 and a low (L) level enables data inputs D01, D11, D21, D31. Any change on the data input will be reflected at the outputs while the clock is low. The outputs are latched on the positive transition of the clock. While the clock is in the high state, a change in the information present at the data inputs will not affect the output information.
LOGIC DIAGRAM
SELECT 9
1 Q0 D00 6 D01 5
2 Q1 D10 4 D11 3
D20 13 D21 12
15 Q2
14 Q3 D30 11 D31 10 CLOCK 7 VCC = PIN 16 VEE = PIN 8
MOTOROLA
2-54
MECL Data DL122 -- Rev 6
MC10H173
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE C
B -N- Y BRK D -L- -M- W D Z
0.007 (0.180) M T L-M U
S
N
S S
0.007 (0.180) M T L-M
N
S
20
1
X V VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R
0.007 (0.180) M T L-M 0.007 (0.180) M T L-M
S
N N
S
S
S
H
0.007 (0.180) M T L-M
S
N
S
C
E 0.004 (0.100) G G1 0.010 (0.250) S T L-M J -T-
SEATING PLANE
K1 K F VIEW S 0.007 (0.180)
M
VIEW S
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
MECL Data DL122 -- Rev 6
2-55
MOTOROLA
MC10H173
OUTLINE DIMENSIONS
L SUFFIX CERAMIC DIP PACKAGE CASE 620-10 ISSUE V
9
-A-
16
-B-
1 8
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
-T-
SEATING PLANE
N E F D G
16 PL
K M J
16 PL
0.25 (0.010)
M
M
TB
S
0.25 (0.010)
TA
S
-A-
16 9
P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
B
1 8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
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JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 2-56
*MC10H173/D*
MC10H173/D MECL Data DL122 -- Rev 6

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